发明授权
- 专利标题： Sealed electric element package
- 专利标题（中）： 密封电气元件包装
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申请号： US13531043申请日： 2012-06-22
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公开(公告)号： US08492856B2公开(公告)日： 2013-07-23
- 发明人: Haruki Ito , Nobuaki Hashimoto
- 申请人： Haruki Ito , Nobuaki Hashimoto
- 申请人地址： JP
- 专利权人： Seiko Epson Corporation
- 当前专利权人： Seiko Epson Corporation
- 当前专利权人地址： JP
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： JP2004-265189 20040913; JP2005-123476 20050421
- 主分类号： H01L27/14
- IPC分类号： H01L27/14 ; H01L29/82 ; H01L29/84 ; H01L23/48 ; H01L23/52
摘要：
An electronic component includes: a semiconductor substrate having a first surface and a second surface opposing to the first surface; a trans-substrate conductive plug that penetrates the semiconductor substrate from the first surface to the second surface; an electronic element provided in the vicinity of the first surface of the semiconductor; and a sealing member that seals the electronic element between the sealing member and the first surface, wherein the electronic element is electrically connected to the trans-substrate conductive plug.
公开/授权文献
- US20120261815A1 SEALED SURFACE ACOUSTIC WAVE ELEMENT PACKAGE 公开/授权日：2012-10-18
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