Invention Grant
- Patent Title: Methods and apparatus for forming nitrogen-containing layers
- Patent Title (中): 用于形成含氮层的方法和装置
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Application No.: US12749088Application Date: 2010-03-29
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Publication No.: US08481433B2Publication Date: 2013-07-09
- Inventor: Malcolm J. Bevan , Johanes Swenberg , Son T. Nguyen , Wei Liu , Jose Antonio Marin , Jian Li
- Applicant: Malcolm J. Bevan , Johanes Swenberg , Son T. Nguyen , Wei Liu , Jose Antonio Marin , Jian Li
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: H01L21/469
- IPC: H01L21/469

Abstract:
Methods and apparatus for forming nitrogen-containing layers are provided herein. In some embodiments, a method includes placing a substrate having a first layer disposed thereon on a substrate support of a process chamber; heating the substrate to a temperature of at least about 250 degrees Celsius; and exposing the first layer to a radio frequency (RF) plasma formed from a process gas comprising nitrogen while maintaining the process chamber at a pressure of about 10 mTorr to about 40 mTorr to transform at least an upper portion of the first layer into a nitrogen-containing layer. In some embodiments, the process gas includes ammonia (NH3).
Public/Granted literature
- US20100248497A1 METHODS AND APPARATUS FOR FORMING NITROGEN-CONTAINING LAYERS Public/Granted day:2010-09-30
Information query
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