发明授权
- 专利标题： Managing thermal budget in annealing of substrates
- 专利标题（中）： 管理基板退火中的热预算
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申请号： US12212214申请日： 2008-09-17
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公开(公告)号： US08314369B2公开(公告)日： 2012-11-20
- 发明人: Stephen Moffatt , Abhilash J. Mayur , Sundar Ramamurthy , Joseph Ranish , Aaron Hunter
- 申请人： Stephen Moffatt , Abhilash J. Mayur , Sundar Ramamurthy , Joseph Ranish , Aaron Hunter
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Patterson & Sheridan, LLP
- 主分类号： H01L21/26
- IPC分类号： H01L21/26 ; F27B5/14 ; F27D13/00
摘要：
A method and apparatus are provided for treating a substrate. The substrate is positioned on a support in a thermal treatment chamber. Electromagnetic radiation is directed toward the substrate to anneal a portion of the substrate. Other electromagnetic radiation is directed toward the substrate to preheat a portion of the substrate. The preheating reduces thermal stresses at the boundary between the preheat region and the anneal region. Any number of anneal and preheat regions are contemplated, with varying shapes and temperature profiles, as needed for specific embodiments. Any convenient source of electromagnetic radiation may be used, such as lasers, heat lamps, white light lamps, or flash lamps.
公开/授权文献
- US20100065547A1 MANAGING THERMAL BUDGET IN ANNEALING OF SUBSTRATES 公开/授权日：2010-03-18
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