发明授权
- 专利标题： Enhanced thermal management of 3-D stacked die packaging
- 专利标题（中）： 3-D堆叠模具封装的增强热管理
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申请号： US12832732申请日： 2010-07-08
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公开(公告)号： US08299608B2公开(公告)日： 2012-10-30
- 发明人: Gerald K. Bartley , David R. Motschman , Kamal K. Sikka , Jamil A. Wakil , Xiaojin Wei , Jiantao Zheng
- 申请人： Gerald K. Bartley , David R. Motschman , Kamal K. Sikka , Jamil A. Wakil , Xiaojin Wei , Jiantao Zheng
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Cantor Colburn LLP
- 代理商 Joseph Petrokaitis
- 主分类号： H01L23/36
- IPC分类号： H01L23/36 ; H01L21/58
摘要：
A die stack package is provided and includes a substrate, a stack of computing components, at least one thermal plate, which is thermally communicative with the stack and a lid supported on the substrate to surround the stack and the at least one thermal plate to thereby define a first heat transfer path extending from one of the computing components to the lid via the at least one thermal plate and a fin coupled to a surface of the lid and the at least one thermal plate, and a second heat transfer path extending from the one of the computing components to the lid surface without passing through the at least one thermal plate.
公开/授权文献
- US20120007229A1 ENHANCED THERMAL MANAGEMENT OF 3-D STACKED DIE PACKAGING 公开/授权日：2012-01-12
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