Invention Grant
US08293847B2 Film-like adhesive, adhesive sheet, and semiconductor device using same
失效
薄膜状粘合剂，粘合片，以及使用其的半导体装置
- Patent Title: Film-like adhesive, adhesive sheet, and semiconductor device using same
- Patent Title (中): 薄膜状粘合剂，粘合片，以及使用其的半导体装置
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Application No.: US12376347Application Date: 2006-08-04
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Publication No.: US08293847B2Publication Date: 2012-10-23
- Inventor: Takashi Masuko , Minoru Sugiura , Shigeki Katogi , Masami Yusa
- Applicant: Takashi Masuko , Minoru Sugiura , Shigeki Katogi , Masami Yusa
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Co., Ltd.
- Current Assignee: Hitachi Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- International Application: PCT/JP2006/315493 WO 20060804
- International Announcement: WO2008/015759 WO 20080207
- Main IPC: C08L75/04
- IPC: C08L75/04
Abstract:
An object of the present invention is to provide a film-like adhesive capable of achieving a superior combination of processability and reflow resistance. A film-like adhesive of the present invention is used for bonding a semiconductor element to an adherend, and includes an adhesive layer comprising at least one resin selected from the group consisting of polyurethaneimide resins, polyurethaneamideimide resins and polyurethaneimide-polyurethaneamideimide resins.
Public/Granted literature
- US20100239858A1 FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING SAME Public/Granted day:2010-09-23
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