发明授权
- 专利标题： Side emitting semiconductor package
- 专利标题（中）： 侧面发射半导体封装
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申请号： US12900676申请日： 2010-10-08
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公开(公告)号： US08270444B2公开(公告)日： 2012-09-18
- 发明人: Min-Tsun Hsieh , Wen-Liang Tseng , Lung-Hsin Chen , Chih-Yung Lin
- 申请人： Min-Tsun Hsieh , Wen-Liang Tseng , Lung-Hsin Chen , Chih-Yung Lin
- 申请人地址： TW Hsinchu Hsien
- 专利权人： Advanced Optoelectronics Technology, Inc.
- 当前专利权人： Advanced Optoelectronics Technology, Inc.
- 当前专利权人地址： TW Hsinchu Hsien
- 代理机构： Altis Law Group, Inc.
- 优先权： TW99105297A 20100224
- 主分类号： H01S3/00
- IPC分类号： H01S3/00 ; H01L33/00
摘要：
A side emitting semiconductor package includes a two-sided electric circuit formed on a silicon substrate of the package, and a plurality of semiconductor light emitting devices bonded on two bilateral surfaces of the electric circuit to provide a surface mounted device with two light emitting sides.
公开/授权文献
- US20110206079A1 SIDE EMITTING SEMICONDUCTOR PACKAGE 公开/授权日：2011-08-25
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