Invention Grant
- Patent Title: LED module and packaging method thereof
- Patent Title (中): LED模块及其封装方法
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Application No.: US12634468Application Date: 2009-12-09
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Publication No.: US08235551B2Publication Date: 2012-08-07
- Inventor: Jian-Shian Lin , Chieh-Lung Lai , Hsiu-Jen Lin , Weng-Jung Lu , Yi-Ping Huang , Ya-Chun Tu
- Applicant: Jian-Shian Lin , Chieh-Lung Lai , Hsiu-Jen Lin , Weng-Jung Lu , Yi-Ping Huang , Ya-Chun Tu
- Applicant Address: TW Hsin-Chu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsin-Chu
- Agency: Morris Manning & Martin LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: TW97150385A 20081224; TW98100152A 20090106; TW98101324A 20090115; TW98132874A 20090929
- Main IPC: F21S4/00
- IPC: F21S4/00 ; F21V21/00 ; H01L23/48
Abstract:
A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.
Public/Granted literature
- US20100157595A1 LED MODULE AND PACKAGING METHOD THEREOF Public/Granted day:2010-06-24
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