Invention Grant
- Patent Title: Heat sink and cooling unit using the same
- Patent Title (中): 散热器和冷却单元使用相同
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Application No.: US11718272Application Date: 2006-01-11
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Publication No.: US08225854B2Publication Date: 2012-07-24
- Inventor: Shigetoshi Ippoushi , Akira Yamada , Takeshi Tanaka , Akihiro Murahashi , Kazuyoshi Toya , Hideo Okayama
- Applicant: Shigetoshi Ippoushi , Akira Yamada , Takeshi Tanaka , Akihiro Murahashi , Kazuyoshi Toya , Hideo Okayama
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2005-007975 20050114
- International Application: PCT/JP2006/300208 WO 20060111
- International Announcement: WO2006/075614 WO 20060720
- Main IPC: F28D7/06
- IPC: F28D7/06 ; F28F7/00
Abstract:
A heat sink including a compact cooling system, superior uniformity of heating, provides a compact cooling unit superior in uniformity of cooling. A heat sink includes a header for distribution connected to a cooling fluid inlet, a header for confluence connected to a cooling fluid outlet and parallel to and adjacent to the header for distribution and a heat transfer vessel including a heating element mounting surface as well as channels inside. The channels are connected to the header for distribution and the header for confluence.
Public/Granted literature
- US20090080159A1 HEAT SINK AND COOLING UNIT USING THE SAME Public/Granted day:2009-03-26
Information query
