Invention Grant
- Patent Title: Bump chip carrier semiconductor package system
- Patent Title (中): 凸块芯片载体半导体封装系统
-
Application No.: US11306806Application Date: 2006-01-11
-
Publication No.: US08124459B2Publication Date: 2012-02-28
- Inventor: In Sang Yoon , Han Shin Youn , Jae Soo Lee
- Applicant: In Sang Yoon , Han Shin Youn , Jae Soo Lee
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Mikio Ishimaru
- Main IPC: H01L21/50
- IPC: H01L21/50
Abstract:
A bump chip carrier semiconductor package system is provided including providing a lead frame, forming circuit sockets in the lead frame, mounting a semiconductor die on the lead frame, wherein the semiconductor die have electrical interconnects that connects to the circuit sockets, and encapsulating a molding compound to cover the semiconductor die and the electrical interconnects.
Public/Granted literature
- US20070108605A1 BUMP CHIP CARRIER SEMICONDUCTOR PACKAGE SYSTEM Public/Granted day:2007-05-17
Information query
IPC分类:
