发明授权
- 专利标题: Semiconductor device and method of forming the same
- 专利标题(中): 半导体器件及其形成方法
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申请号: US12662150申请日: 2010-04-01
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公开(公告)号: US08120123B2公开(公告)日: 2012-02-21
- 发明人: Makoto Yoshida , Hyeong-Sun Hong , Kye-Hee Yeom , Dae-Ik Kim , Yong-Il Kim
- 申请人: Makoto Yoshida , Hyeong-Sun Hong , Kye-Hee Yeom , Dae-Ik Kim , Yong-Il Kim
- 申请人地址: KR Suwon-si, Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-do
- 代理机构: Lee & Morse, P.C.
- 优先权: KR10-2007-0094725 20070918; KR10-2008-0083457 20080826; KR10-2009-0029012 20090403
- 主分类号: H01L23/52
- IPC分类号: H01L23/52 ; H01L27/088
摘要:
A semiconductor device, and a method of forming the same, includes forming a cell bit line pattern and a peripheral gate pattern on a semiconductor substrate. The cell bit line pattern may be formed on an inactive region adjacent to a cell active region of the semiconductor substrate. The peripheral gate pattern may be disposed on a peripheral active region of the semiconductor substrate. A cell contact plug may be formed between the cell bit line pattern and the cell active region. A peripheral contact plug may be formed on the peripheral active region on a side of the peripheral gate pattern. An insulating layer may be formed to expose top surfaces of the cell bit line pattern, the peripheral gate pattern, and the cell and peripheral contact plugs at substantially the same level.
公开/授权文献
- US20100193880A1 Semiconductor device and method of forming the same 公开/授权日:2010-08-05
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