Invention Grant
- Patent Title: Semiconductor component having a space saving edge structure
- Patent Title (中): 半导体元件具有节省空间的边缘结构
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Application No.: US11833328Application Date: 2007-08-03
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Publication No.: US08080858B2Publication Date: 2011-12-20
- Inventor: Franz Hirler , Ralf Siemieniec , Christian Geissler
- Applicant: Franz Hirler , Ralf Siemieniec , Christian Geissler
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102006036347 20060803
- Main IPC: H01L29/02
- IPC: H01L29/02 ; H01L29/66 ; H01L29/06 ; H01L23/58

Abstract:
A Semiconductor component having a space saving edge structure is disclosed. One embodiment provides a first side, a second side, an inner region, an edge region adjoining the inner region in a lateral direction of the semiconductor body, and a first semiconductor layer extending across the inner region and the edge region and having a basic doping of a first conductivity type. At least one active component zone of a second conductivity type, which is complementary to the first conductivity type, is disposed in the inner region in the first semiconductor layer. An edge structure is disposed in the edge region and includes at least one trench extending from the first side into the semiconductor body. An edge electrode is disposed in the trench, a dielectric layer is disposed in the trench between the edge electrode and the semiconductor body, a first edge zone of the second conductivity type adjoin the trench and are at least partially disposed below the trench.
Public/Granted literature
- US20080042172A1 SEMICONDUCTOR COMPONENT HAVING A SPACE SAVING EDGE STRUCTURE Public/Granted day:2008-02-21
Information query
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