发明授权
- 专利标题: Semiconductor component having a space saving edge structure
- 专利标题(中): 半导体元件具有节省空间的边缘结构
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申请号: US11833328申请日: 2007-08-03
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公开(公告)号: US08080858B2公开(公告)日: 2011-12-20
- 发明人: Franz Hirler , Ralf Siemieniec , Christian Geissler
- 申请人: Franz Hirler , Ralf Siemieniec , Christian Geissler
- 申请人地址: AT Villach
- 专利权人: Infineon Technologies Austria AG
- 当前专利权人: Infineon Technologies Austria AG
- 当前专利权人地址: AT Villach
- 代理机构: Dicke, Billig & Czaja, PLLC
- 优先权: DE102006036347 20060803
- 主分类号: H01L29/02
- IPC分类号: H01L29/02 ; H01L29/66 ; H01L29/06 ; H01L23/58
摘要:
A Semiconductor component having a space saving edge structure is disclosed. One embodiment provides a first side, a second side, an inner region, an edge region adjoining the inner region in a lateral direction of the semiconductor body, and a first semiconductor layer extending across the inner region and the edge region and having a basic doping of a first conductivity type. At least one active component zone of a second conductivity type, which is complementary to the first conductivity type, is disposed in the inner region in the first semiconductor layer. An edge structure is disposed in the edge region and includes at least one trench extending from the first side into the semiconductor body. An edge electrode is disposed in the trench, a dielectric layer is disposed in the trench between the edge electrode and the semiconductor body, a first edge zone of the second conductivity type adjoin the trench and are at least partially disposed below the trench.
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