发明授权
- 专利标题： Integrated circuit package system with dual connectivity
- 专利标题（中）： 具有双重连接的集成电路封装系统
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申请号： US11936532申请日： 2007-11-07
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公开(公告)号： US07977782B2公开(公告)日： 2011-07-12
- 发明人: Zigmund Ramirez Camacho , Jairus Legaspi Pisigan , Jose Alvin Caparas , Lionel Chien Hui Tay
- 申请人： Zigmund Ramirez Camacho , Jairus Legaspi Pisigan , Jose Alvin Caparas , Lionel Chien Hui Tay
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L23/48
摘要：
An integrated circuit package system includes: forming a lead having a both top contact portion and a bottom contact portion; connecting an integrated circuit die and the lead; and forming a package encapsulation, having a top side and a bottom side, over the integrated circuit die. The forming the package encapsulation includes partially exposing the top contact portion at the top side, and partially exposing the bottom contact portion along the bottom side with the bottom contact portion extending beyond a nonhorizontal portion of the package encapsulation.
公开/授权文献
- US20090115032A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL CONNECTIVITY 公开/授权日：2009-05-07
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