Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12749176Application Date: 2010-03-29
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Publication No.: US07968912B2Publication Date: 2011-06-28
- Inventor: Yong-Soo Kim , Hong-Seon Yang , Seung-Ho Pyi , Tae-Hang Ahn
- Applicant: Yong-Soo Kim , Hong-Seon Yang , Seung-Ho Pyi , Tae-Hang Ahn
- Applicant Address: KR Icheon-si
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Icheon-si
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: KR10-2007-0062779 20070626
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L27/12

Abstract:
A semiconductor device includes a substrate, a gate formed over the substrate, a gate spacer provided against first and second sidewalls of the gate, and a source/drain region formed in the substrate proximate to the gate spacer. The source/drain region includes first and second epitaxial layers including Ge, wherein the second epitaxial layer which is formed over an interfacial layer between the first epitaxial layer and the substrate has a higher germanium concentration than that of the first epitaxial layer.
Public/Granted literature
- US20100181599A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2010-07-22
Information query
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