发明授权
- 专利标题： Method of manufacturing wiring board
- 专利标题（中）： 制造布线板的方法
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申请号： US11509684申请日： 2006-08-25
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公开(公告)号： US07937828B2公开(公告)日： 2011-05-10
- 发明人: Takaharu Yamano
- 申请人： Takaharu Yamano
- 申请人地址： JP Nagano-shi, Nagano
- 专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人地址： JP Nagano-shi, Nagano
- 代理机构： Drinker Biddle & Reath LLP
- 优先权： JPP.2005-246438 20050826
- 主分类号： H05K3/20
- IPC分类号： H05K3/20
摘要：
A method of manufacturing a wiring board including an insulating layer where a semiconductor chip is embedded includes: forming, on a supporting board, the insulating layer where the semiconductor chip is embedded and a wiring connected to the semiconductor chip; removing the supporting board by etching; and simultaneously forming first and second reinforcing layers so as to sandwich the insulating layer after removing the supporting board.
公开/授权文献
- US20070044303A1 Method of manufacturing wiring board 公开/授权日：2007-03-01
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