发明授权
- 专利标题： Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof
- 专利标题（中）： 具有外露端子互连的集成电路封装系统及其制造方法
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申请号： US12331416申请日： 2008-12-09
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公开(公告)号： US07919850B2公开(公告)日： 2011-04-05
- 发明人: Arnel Senosa Trasporto , Lionel Chien Hui Tay , Zigmund Ramirez Camacho , Abelardo Hadap Advincula, Jr.
- 申请人： Arnel Senosa Trasporto , Lionel Chien Hui Tay , Zigmund Ramirez Camacho , Abelardo Hadap Advincula, Jr.
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L23/04
- IPC分类号： H01L23/04 ; H01L23/02
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a lead; mounting an inner package so that the lead is peripheral to the inner package, and the inner package having a connection pad; forming an exposed terminal interconnect on the connection pad; and encapsulating the inner package, and partially encapsulating the exposed terminal interconnect with an encapsulation.
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