发明授权
- 专利标题： Integrated circuit package system with multiple devices
- 专利标题（中）： 具有多个器件的集成电路封装系统
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申请号： US11833898申请日： 2007-08-03
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公开(公告)号： US07919848B2公开(公告)日： 2011-04-05
- 发明人: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Abelardo Jr Hadap Advincula , Lionel Chien Hui Tay
- 申请人： Zigmund Ramirez Camacho , Henry Descalzo Bathan , Abelardo Jr Hadap Advincula , Lionel Chien Hui Tay
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Mikio Ishimaru
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/56
摘要：
An integrated circuit package system includes: forming a die-attach paddle, an outer interconnect, and an inner interconnect toward the die-attach paddle beyond the outer interconnect; mounting an integrated circuit device over the die-attach paddle; connecting the integrated circuit device to the inner interconnect and the outer interconnect; encapsulating the integrated circuit device over the die-attach paddle; attaching an external interconnect under the outer interconnect; and attaching a circuit device under the die-attach paddle and extended laterally beyond opposite sides of the die-attach paddle.
公开/授权文献
- US20090032918A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DEVICES 公开/授权日：2009-02-05
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