Invention Grant
- Patent Title: Heterojunction semiconductor device and method of manufacturing
- Patent Title (中): 异质结半导体器件及其制造方法
-
Application No.: US11419348Application Date: 2006-05-19
-
Publication No.: US07915640B2Publication Date: 2011-03-29
- Inventor: Masaya Uemura
- Applicant: Masaya Uemura
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JPP2005-152570 20050525
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L31/102 ; H01L29/66 ; H01L31/00 ; H01L21/331 ; H01L21/8222

Abstract:
A metamorphic buffer layer is formed on a semi-insulating substrate by an epitaxial growth method, a collector layer, a base layer, an emitter layer and an emitter cap layer are sequentially laminated on the metamorphic buffer layer, and a collector electrode is provided in contact with an upper layer of the metamorphic buffer layer. The metamorphic buffer layer is doped with an impurity, in a concentration equivalent to or higher than that in a conventional sub-collector layer, by an impurity doping process during crystal growth so that the metamorphic buffer layer will be able to play the role of guiding the collector current to the collector electrode. Since the sub-collector layer, which is often formed of a ternary mixed crystal or the like having a high thermal resistance, can be omitted, the heat generated in the semiconductor device can be rapidly released into the substrate.
Public/Granted literature
- US20080203426A1 HETEROJUNCTION SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING Public/Granted day:2008-08-28
Information query
IPC分类: