Invention Grant
- Patent Title: Die clamping method
- Patent Title (中): 模夹方式
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Application No.: US12486437Application Date: 2009-06-17
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Publication No.: US07867415B2Publication Date: 2011-01-11
- Inventor: Jun Koike , Takaki Miyauchi , Makoto Nishizawa , Nobuyuki Muroi , Haruyuki Matsubayashi
- Applicant: Jun Koike , Takaki Miyauchi , Makoto Nishizawa , Nobuyuki Muroi , Haruyuki Matsubayashi
- Applicant Address: JP Tokyo
- Assignee: Toshiba Kikai Kabushiki Kaisha
- Current Assignee: Toshiba Kikai Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: DLA Piper LLP US
- Priority: JP2004-023975 20040130; JP2005-011682 20050119
- Main IPC: B29C45/64
- IPC: B29C45/64

Abstract:
Used in a method of this invention is a die clamping unit, which comprises a tie bar movably attached to a stationary platen, a halfnut positioning servomotor which advances and retreats to the tie bar, a halfnut which is provided on a movable platen and fixes the movable platen and the tie bar together by engaging the tie bar, an engaging mechanism which engages the halfnut with the tie bar, a hydraulic die clamping cylinder which presses the stationary platen and the movable platen, and a control device which controls the halfnut positioning servomotor and the hydraulic cylinder. The control device drives the halfnut positioning servomotor to remove a clearance between the halfnut and an engaging groove of the tie bar before a die clamping process carried out by the hydraulic cylinder.
Public/Granted literature
- US20090261496A1 DIE CLAMPING UNIT AND DIE CLAMPING METHOD Public/Granted day:2009-10-22
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