Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US11979565Application Date: 2007-11-06
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Publication No.: US07838914B2Publication Date: 2010-11-23
- Inventor: Masao Yamane , Atsushi Kurokawa , Shinya Osakabe , Eigo Tange , Yasushi Shigeno , Hiroyuki Takazawa
- Applicant: Masao Yamane , Atsushi Kurokawa , Shinya Osakabe , Eigo Tange , Yasushi Shigeno , Hiroyuki Takazawa
- Applicant Address: JP Kawasaki
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki
- Agency: Mattingly & Malur, P.C.
- Priority: JP2003-397982 20031127
- Main IPC: H01L31/00
- IPC: H01L31/00 ; H01L31/113

Abstract:
The present invention miniaturizes a HEMT element used as a switching element in a radio frequency module. A single gate electrode 17 is formed in an active region defined by an element separation portion 9 on a main surface of a substrate 1 comprising GaAs. The gate electrode 17 is patterned so as to extend in the vertical direction of the page surface between source electrodes 13 and drain electrodes 14, and to extend in left and right directions at other portions. Thus, the ratio of the gate electrode 17 disposed outside the active region is reduced, and the area of a gate pad 17A is reduced.
Public/Granted literature
- US20080073671A1 Semiconductor device Public/Granted day:2008-03-27
Information query
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