发明授权
- 专利标题: Microfluidic connections
- 专利标题(中): 微流体连接
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申请号: US10599591申请日: 2005-04-01
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公开(公告)号: US07802923B2公开(公告)日: 2010-09-28
- 发明人: Don W. Arnold , Kenneth R. Hencken , Sammy S. Datwani , Patrick Pak-Ho Leung , Douglas R. Cyr , Jason E. Rehm
- 申请人: Don W. Arnold , Kenneth R. Hencken , Sammy S. Datwani , Patrick Pak-Ho Leung , Douglas R. Cyr , Jason E. Rehm
- 申请人地址: US MA Framingham
- 专利权人: AB Sciex LLC
- 当前专利权人: AB Sciex LLC
- 当前专利权人地址: US MA Framingham
- 代理机构: Sheldon Mak & Anderson
- 国际申请: PCT/US2005/011021 WO 20050401
- 国际公布: WO2005/096751 WO 20051020
- 主分类号: G02B6/36
- IPC分类号: G02B6/36 ; G02B6/38
摘要:
A junction is made between a first microfluidic substrate (12) having an elongate component (303) protruding from it and a second microfluidic substrate (22) having a corresponding conduit (261). Each of the substrates has a pair of alignment features, for example planar orthogonal surfaces (13,15; 23,25) or grooves (141,151; 241, 251) in opposite sides of the substrate. The substrates are placed on an alignment jig 6 having location features (63, 65) corresponding to the alignment features. The elongate component can be surrounded by a compressible gasket 40). The substrates are pushed towards each other so that the elongate component enters the conduit and the gasket, if any, is compressed. A fluid-tight junction results so long as the substrates are maintained in the necessary position, either by permanent means, or, if a junction which can be disassembled is needed, by maintaining pressure between the substrates. Novel apparatus and novel microfluidic assemblies, including microfluidic chips having grooves in their sides, are described.
公开/授权文献
- US20090129728A1 Microfluidic Connections 公开/授权日:2009-05-21
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