Invention Grant
US07671373B2 LED chip package structure using a ceramic material as a substrate and a method for manufacturing the same
有权
使用陶瓷材料作为基板的LED芯片封装结构及其制造方法
- Patent Title: LED chip package structure using a ceramic material as a substrate and a method for manufacturing the same
- Patent Title (中): 使用陶瓷材料作为基板的LED芯片封装结构及其制造方法
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Application No.: US11976478Application Date: 2007-10-25
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Publication No.: US07671373B2Publication Date: 2010-03-02
- Inventor: Bily Wang , Jonnie Chuang , Chia-Hung Chen
- Applicant: Bily Wang , Jonnie Chuang , Chia-Hung Chen
- Applicant Address: TW Hsinchu
- Assignee: Harvatek Corporation
- Current Assignee: Harvatek Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Rosenberg, Klein & Lee
- Priority: TW96102114A 20070119
- Main IPC: H01L29/267
- IPC: H01L29/267 ; H01L21/15 ; H01L29/26 ; H01L31/12 ; H01L29/16 ; H01L29/18 ; H01L29/22 ; H01L29/24 ; H01L25/16
Abstract:
An LED chip package structure using a ceramic material as a substrate includes a ceramic substrate, a conductive unit, a hollow ceramic casing, a plurality of LED chips, and a package colloid. The ceramic substrate has a main body, and a plurality of protrusions extended from three faces of the main body. The conductive unit has a plurality of conductive layers formed on the protrusions, respectively. The hollow casing is fixed on a top face of the main body to form a receiving space for exposing a top face of each conductive layer. The LED chips are received in the receiving space, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected to different conductive layers. In addition, the packaging colloid is filled into the receiving space for covering the LED chips.
Public/Granted literature
Information query
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