Invention Grant
US07569483B2 Methods of forming metal silicide layers by annealing metal layers using inert heat transferring gases established in a convection apparatus
有权
通过在对流装置中建立的惰性热传递气体退火金属层来形成金属硅化物层的方法
- Patent Title: Methods of forming metal silicide layers by annealing metal layers using inert heat transferring gases established in a convection apparatus
- Patent Title (中): 通过在对流装置中建立的惰性热传递气体退火金属层来形成金属硅化物层的方法
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Application No.: US11199439Application Date: 2005-08-08
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Publication No.: US07569483B2Publication Date: 2009-08-04
- Inventor: Sug-Woo Jung , Gil-Heyun Choi , Jong-Ho Yun , Kwan-Jong Roh , Eun-Ji Jung , Hyun-Su Kim
- Applicant: Sug-Woo Jung , Gil-Heyun Choi , Jong-Ho Yun , Kwan-Jong Roh , Eun-Ji Jung , Hyun-Su Kim
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec
- Priority: KR10-2004-0062632 20040809
- Main IPC: H01L21/44
- IPC: H01L21/44

Abstract:
Methods of forming metal silicide layers include a convection-based annealing step to convert a metal layer into a metal silicide layer. These methods may include forming a silicon layer on a substrate and forming a metal layer (e.g., nickel layer) in direct contact with the silicon layer. A step is then performed to convert at least a portion of the metal layer into a metal silicide layer. This conversion step is includes exposing the metal layer to an inert heat transferring gas (e.g., argon, nitrogen) in a convection or conduction apparatus.
Public/Granted literature
- US20060063380A1 Salicide process and method of fabricating semiconductor device using the same Public/Granted day:2006-03-23
Information query
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