Invention Grant
US07528488B2 Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure
失效
电极连接方法,表面处理电路板和方法中使用的粘合膜,以及电极连接结构
- Patent Title: Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure
- Patent Title (中): 电极连接方法,表面处理电路板和方法中使用的粘合膜,以及电极连接结构
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Application No.: US11494708Application Date: 2006-07-28
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Publication No.: US07528488B2Publication Date: 2009-05-05
- Inventor: Isao Tsukagoshi , Yasushi Gotou , Masami Yusa , Yasuo Miyadera
- Applicant: Isao Tsukagoshi , Yasushi Gotou , Masami Yusa , Yasuo Miyadera
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Co., Ltd.
- Current Assignee: Hitachi Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2002-53910 20020228; JP2002-53911 20020228
- Main IPC: H01L23/52
- IPC: H01L23/52

Abstract:
The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.
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