Invention Grant
- Patent Title: Nitride semiconductor wafer
- Patent Title (中): 氮化物半导体晶圆
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Application No.: US11612481Application Date: 2006-12-19
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Publication No.: US07390359B2Publication Date: 2008-06-24
- Inventor: Michimasa Miyanaga , Koji Uematsu , Takuji Okahisa
- Applicant: Michimasa Miyanaga , Koji Uematsu , Takuji Okahisa
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agent James W. Judge
- Priority: JP2004-293844 20041006
- Main IPC: C30B25/12
- IPC: C30B25/12

Abstract:
A nitride semiconductor substrate having properties preferable for the manufacture of various nitride semiconductor devices is made available, by specifying or controlling the local variation in the off-axis angle of the principal surface of the nitride semiconductor substrate. In a nitride semiconductor single-crystal wafer having a flat principal surface, the crystallographic plane orientation of the principal surface of the nitride semiconductor single-crystal wafer varies locally within a predetermined angular range.
Public/Granted literature
- US20070096117A1 Nitride Semiconductor Wafer Public/Granted day:2007-05-03
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