Invention Grant
- Patent Title: Backside coating for MEMS wafer
- Patent Title (中): MEMS晶圆的背面涂层
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Application No.: US11056142Application Date: 2005-02-10
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Publication No.: US07153768B2Publication Date: 2006-12-26
- Inventor: Fei-Yuh Chen , Eugene Chu , Yuh-Hwa Chang , David Ho
- Applicant: Fei-Yuh Chen , Eugene Chu , Yuh-Hwa Chang , David Ho
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Co.
- Current Assignee: Taiwan Semiconductor Manufacturing Co.
- Current Assignee Address: TW
- Agency: Duane Morris LLP
- Agent Steven E. Koffs
- Main IPC: H01L21/4763
- IPC: H01L21/4763 ; H01L21/44 ; H01L21/46
Abstract:
A transparent substrate has a micro electro-mechanical system (MEMS) on a first side of the substrate. An opaque layer is formed on a second side of the transparent substrate opposite the first side. The opaque layer comprises a first material that is removable by a MEMS release process. A second layer is formed on the opaque layer. The second layer comprises a second material that prevents contamination of a front end of line machine by the first material during a front end of line fabrication process.
Public/Granted literature
- US20060177992A1 Backside coating for MEMS wafer Public/Granted day:2006-08-10
Information query
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