发明授权
- 专利标题： Microelectronic packages with elongated solder interconnections
- 专利标题（中）： 具有细长焊料互连的微电子封装
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申请号： US09854269申请日： 2001-05-11
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公开(公告)号： US07078819B2公开(公告)日： 2006-07-18
- 发明人: Thomas H. DiStefano
- 申请人： Thomas H. DiStefano
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
A soldered assembly for a microelectronic element includes a microelectronic element, solder columns extending from a surface of the microelectronic element and terminals connected to distal ends of the columns. The assembly can be handled and mounted using conventional surface-mount techniques, but provides thermal fatigue resistance. The solder columns may be inclined relative to the chip surface, and may contain long, columnar inclusions preferentially oriented along the lengthwise axes of the columns.
公开/授权文献
- US20010020748A1 Microelectronic packages with solder interconnections 公开/授权日：2001-09-13
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