- 专利标题： Methods for forming wiring and electrode
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申请号： US10808441申请日： 2004-03-25
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公开(公告)号： US07071084B2公开(公告)日： 2006-07-04
- 发明人: Yasuaki Yokoyama , Isamu Yonekura , Takashi Satoh , Tamaki Wakasaki , Yasumasa Takeuchi , Masayuki Endo
- 申请人： Yasuaki Yokoyama , Isamu Yonekura , Takashi Satoh , Tamaki Wakasaki , Yasumasa Takeuchi , Masayuki Endo
- 申请人地址： JP Tokyo JP Osaka JP Kawasaki
- 专利权人： JSR Corporation,Sharp Corporation,International Center for Materials Research
- 当前专利权人： JSR Corporation,Sharp Corporation,International Center for Materials Research
- 当前专利权人地址： JP Tokyo JP Osaka JP Kawasaki
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权： JP2003-091789 20030328
- 主分类号： H01L21/30
- IPC分类号： H01L21/30 ; H01L21/46
摘要：
There is provided a method for forming wiring or an electrode by coating a substrate with a composition comprising (A) a complex of an amine compound and a hydrogenated aluminum compound and (B) a titanium compound or a composition comprising the complex and (C) metal particles and subjecting the obtained coating film to heating and/or a light treatment. By the method, a film can be formed that uses a conductive film forming composition with which wiring and an electrode that can be suitably used for electronic devices can be formed easily and inexpensively.
公开/授权文献
- US20040192038A1 Methods for forming wiring and electrode 公开/授权日：2004-09-30
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