Invention Grant
- Patent Title: Laminate for printed circuit boards
- Patent Title (中): 印刷电路板层压板
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Application No.: US10279983Application Date: 2002-10-25
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Publication No.: US07063883B2Publication Date: 2006-06-20
- Inventor: Neil Brown , Michael Aggleton
- Applicant: Neil Brown , Michael Aggleton
- Applicant Address: US VA Richmond
- Assignee: Albemarle Corporation
- Current Assignee: Albemarle Corporation
- Current Assignee Address: US VA Richmond
- Agent Jeremy J. Kliebert
- Priority: GB9700708 19970115
- Main IPC: B32B5/00
- IPC: B32B5/00 ; B32B27/00 ; B32B17/00
Abstract:
Laminates for printed circuit boards having surface layers of curable resin impregnated woven glass fabric and intermediate layers of curable resin impregnated non-woven glass. The intermediate layers contain 200 percent by weight to 275 percent by weight, based on the resin in the intermediate layers, of a thermally stable aluminum hydroxide of the molecular formula Al2O3.nH2O, wherein n has a value of 2.6
Public/Granted literature
- US20030059367A1 Laminate for printed circuit boards Public/Granted day:2003-03-27
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