- 专利标题: Molding die apparatus, method for molding disc substrate, and disc-shaped recording medium
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申请号: US09950852申请日: 2001-09-12
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公开(公告)号: US07008216B2公开(公告)日: 2006-03-07
- 发明人: Yoshihito Fukushima
- 申请人: Yoshihito Fukushima
- 申请人地址: JP Tokyo
- 专利权人: Sony Corporation
- 当前专利权人: Sony Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Frommer Lawrence & Haug LLP
- 代理商 William S. Frommer
- 优先权: JPP2000-280629 20000914
- 主分类号: B29D11/00
- IPC分类号: B29D11/00
摘要:
Preventing a molded disc substrate from generating a separation pattern. To this end, a molding die 1 includes a pair of stationary die 6 and movable die 7, and an outer circumference ring 16 for molding an outer circumference end of the disc substrate 2. The outer circumference ring 16 is so mounted as to be movable along forward and backward directions in parallel with a moving direction of the movable die 7 toward the stationary die 6, and has a retaining surface 39 for retaining the outer circumference of the molded disc substrate 2.
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