发明授权
- 专利标题： Method making bonding pad
- 专利标题（中）： 方法制作焊盘
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申请号： US10229443申请日： 2002-08-27
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公开(公告)号： US06987057B2公开(公告)日： 2006-01-17
- 发明人: Ellis Lee , Yimin Huang , Tri-Rung Yew
- 申请人： Ellis Lee , Yimin Huang , Tri-Rung Yew
- 申请人地址： TW Hsinchu
- 专利权人： United Microelectronics Corp.
- 当前专利权人： United Microelectronics Corp.
- 当前专利权人地址： TW Hsinchu
- 代理机构： J.C. Patents
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
An bonding pad structure has a passivation layer over a copper layer having a pad window to expose a portion of the copper layer, a barrier layer conformal to a profile of the pad window, and an aluminum pad located in the pad window. The metal layer can be an aluminum, aluminum alloy or aluminum dominated layer for providing a better adhesion property between the copper layer and the bonding wire.
公开/授权文献
- US20030006505A1 Bonding pad structure and method for making same 公开/授权日：2003-01-09
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