Invention Grant
- Patent Title: Method and apparatus for detecting pattern defects
- Patent Title (中): 检测图案缺陷的方法和装置
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Application No.: US10223423Application Date: 2002-08-20
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Publication No.: US06943876B2Publication Date: 2005-09-13
- Inventor: Minoru Yoshida , Sachio Uto , Shunji Maeda , Toshihiko Nakata
- Applicant: Minoru Yoshida , Sachio Uto , Shunji Maeda , Toshihiko Nakata
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP
- Priority: JP2002-166456 20020607
- Main IPC: G01B11/30
- IPC: G01B11/30 ; G01N21/956 ; H01L21/66 ; G02N21/88

Abstract:
A method and apparatus for detecting pattern defects which includes annularly scanning of a laser beam emitted from a laser light source on a pupil of an objective lens, illuminating the scanned laser beam, through the objective lens, onto a sample on which there is formed a pattern coated with an optically transparent thin film, acquiring an optical image of the illuminated sample, and processing the acquired image to find defects in the pattern. The annular scan diameter of the laser beam is determined based on the thickness of the optically transparent thin film.
Public/Granted literature
- US20030227617A1 Method and apparatus for detecting pattern defects Public/Granted day:2003-12-11
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