Invention Grant
US06908836B2 Method of implanting a substrate and an ion implanter for performing the method
有权
植入基板的方法和用于执行该方法的离子注入机
- Patent Title: Method of implanting a substrate and an ion implanter for performing the method
- Patent Title (中): 植入基板的方法和用于执行该方法的离子注入机
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Application No.: US10251780Application Date: 2002-09-23
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Publication No.: US06908836B2Publication Date: 2005-06-21
- Inventor: Adrian Murrell , Bernard Harrison , Peter Edwards , Peter Kindersley , Takao Sakase , Marvin Farley , Shu Satoh , Geoffrey Ryding
- Applicant: Adrian Murrell , Bernard Harrison , Peter Edwards , Peter Kindersley , Takao Sakase , Marvin Farley , Shu Satoh , Geoffrey Ryding
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Boult Wade Tennant
- Main IPC: G01N23/00
- IPC: G01N23/00 ; H01J37/317 ; H01L21/00 ; H01L21/26 ; H01L21/42
Abstract:
An implanter provides two-dimensional scanning of a substrate relative to an implant beam so that the beam draws a raster of scan lines on the substrate. The beam current is measured at turnaround points off the substrate and the current value is used to control the subsequent fast scan speed so as to compensate for the effect of any variation in beam current on dose uniformity in the slow scan direction. The scanning may produce a raster of non-intersecting uniformly spaced parallel scan lines and the spacing between the lines is selected to ensure appropriate dose uniformity.
Public/Granted literature
- US20040058513A1 Method of implanting a substrate and an ion implanter for performing the method Public/Granted day:2004-03-25
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