Invention Grant
US06819527B1 Magnetic head with lower coil traces connected to integrally formed vertical interconnects and upper coil traces through plural insulating layer arrangement
失效
具有连接到整体形成的垂直互连的下线圈迹线和通过多个绝缘层布置的上线圈迹线的磁头
- Patent Title: Magnetic head with lower coil traces connected to integrally formed vertical interconnects and upper coil traces through plural insulating layer arrangement
- Patent Title (中): 具有连接到整体形成的垂直互连的下线圈迹线和通过多个绝缘层布置的上线圈迹线的磁头
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Application No.: US09535089Application Date: 2000-03-23
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Publication No.: US06819527B1Publication Date: 2004-11-16
- Inventor: Frederick Hayes Dill , Robert Edward Fontana, Jr. , Richard Hsiao , Hugo Alberto Emilio Santini
- Applicant: Frederick Hayes Dill , Robert Edward Fontana, Jr. , Richard Hsiao , Hugo Alberto Emilio Santini
- Main IPC: G11B517
- IPC: G11B517

Abstract:
A magnetic head having a helical induction coil. The helical coil is fabricated around a magnetic pole yoke in a series of process steps that include a reactive ion etch (RIE) process step which is utilized to simultaneously form vertical interconnect vias and upper helical coil member trenches. Thereafter, in a single fabrication step, such as by electroplating, the vertical interconnect lines and the upper helical coil traces are created in a single fabrication step, such that they are integrally formed. The vertical interconnect lines provide an electrical connection between outer ends of previously formed lower helical coil traces and outer ends of the integrally formed upper helical coil traces, such that a helical coil is fabricated. In the preferred embodiment, the helical coil is composed of copper.
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