Invention Grant
- Patent Title: Integrated gyroscope of semiconductor material
- Patent Title (中): 半导体材料的集成陀螺仪
-
Application No.: US10128133Application Date: 2002-04-23
-
Publication No.: US06766689B2Publication Date: 2004-07-27
- Inventor: Guido Spinola Durante , Sarah Zerbini , Simone Gardella
- Applicant: Guido Spinola Durante , Sarah Zerbini , Simone Gardella
- Priority: EP01830277 20010427
- Main IPC: G01P904
- IPC: G01P904

Abstract:
The gyroscope is formed by a driving system including a driving mass having an open concave shape; an accelerometer including a sensing mass and comprising mobile sensing electrodes; a linkage connecting the driving mass to the sensing mass. The sensing mass is surrounded on three sides by the driving mass and has a peripheral portion not facing the sensing mass. The mobile sensing electrodes extend integral with the sensing mass from the peripheral portion not facing the driving mass and are interleaved with fixed sensing electrodes. Thereby, there are no passing electrical connections extending below the sensing mass. Moreover the linkage includes springs placed equidistant from the center of gravity of the accelerometer, and the gyroscope is anchored to the substrate with anchoring springs placed equidistant from the center of gravity of the assembly formed by the driving system and by the accelerometer.
Public/Granted literature
- US20020189354A1 Integrated gyroscope of semiconductor material Public/Granted day:2002-12-19
Information query