发明授权
US06664549B2 Wafer chuck, exposure system, and method of manufacturing semiconductor device
有权
晶圆卡盘，曝光系统以及制造半导体器件的方法
- 专利标题： Wafer chuck, exposure system, and method of manufacturing semiconductor device
- 专利标题（中）： 晶圆卡盘，曝光系统以及制造半导体器件的方法
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申请号： US10182389申请日： 2002-07-29
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公开(公告)号： US06664549B2公开(公告)日： 2003-12-16
- 发明人: Seiichiro Kobayashi , Koichi Koyanagi , Teruo Honda , Hideo Saeki , Masaharu Motohashi
- 申请人： Seiichiro Kobayashi , Koichi Koyanagi , Teruo Honda , Hideo Saeki , Masaharu Motohashi
- 优先权： JP2000-20036 20000128
- 主分类号： H01L2168
- IPC分类号： H01L2168
摘要：
In a wafer chuck for flatly vacuum-chucking a semiconductor wafer (11) supported by support pins (15) such that a pressure in a suction chamber (13) surrounded by an external wall (12), the upper surface of the external wall (12) is formed to be lower than the upper surfaces of the support pins, and the upper surface of the external wall (12) does not pressure the semiconductor wafer (11), a distance (L1) between the external wall (12) and closest support pins (15a) is up to 1.8 mm, and an alignment pitch. (L2) of the support pins (15) aligned inside the closest support pins (15a) to the external wall (12) is not more than 1.5 times of the distance (L1) between the external wall (12) and the closest support pins (15a).
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