Invention Grant
- Patent Title: SOI substrate and method for production thereof
- Patent Title (中): SOI衬底及其制造方法
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Application No.: US09601441Application Date: 2000-08-01
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Publication No.: US06617034B1Publication Date: 2003-09-09
- Inventor: Isao Hamaguchi , Atsushi Ikari , Atsuki Matsumura , Keisuke Kawamura , Takayuki Yano , Yoichi Nagatake
- Applicant: Isao Hamaguchi , Atsushi Ikari , Atsuki Matsumura , Keisuke Kawamura , Takayuki Yano , Yoichi Nagatake
- Priority: JP10-020862 19980202; JP10-231828 19980818
- Main IPC: H01L21265
- IPC: H01L21265

Abstract:
A SOI substrate of high quality which allows LSI to be formed thereon in an improved yield and realizes excellent electric properties and a method for the production thereof are provided. The SOI substrate is obtained by forming an embedded oxide layer on a silicon single crystal substrate and forming a SOI layer for the formation of a device on the embedded oxide layer and is characterized by the SOI layer containing pit-like defects at a density of not more than 5 cm−2 or the embedded oxide layer containing pinhole defects at a density of less than one piece/cm2.
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