Invention Grant
US06020219A Method of packaging fragile devices with a gel medium confined by a rim member 失效
用由边缘构件限定的凝胶介质包装脆弱装置的方法

Method of packaging fragile devices with a gel medium confined by a rim
member
Abstract:
A fragile device, such as an integrated circuit chip or a multichip assembly, is packaged by first dispensing a sol surrounding the sides of the device. The sol is laterally confined by means of a rim member typically made of a pre-molded plastic material. The amount of the sol dispensed is not sufficient to run over the top of the rim member. The sol is then heated to form a gel. If desired, a cover member can be put into place onto the top surface of the rim member, for the purpose of additional mechanical protection of the fragile device, for example.
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