Invention Grant
US5786268A Method for forming programmable interconnect structures and programmable
integrated circuits
失效
用于形成可编程互连结构和可编程集成电路的方法
- Patent Title: Method for forming programmable interconnect structures and programmable integrated circuits
- Patent Title (中): 用于形成可编程互连结构和可编程集成电路的方法
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Application No.: US904387Application Date: 1997-08-01
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Publication No.: US5786268APublication Date: 1998-07-28
- Inventor: Kathryn E. Gordon , Richard J. Wong
- Applicant: Kathryn E. Gordon , Richard J. Wong
- Applicant Address: CA Sunnyvale
- Assignee: QuickLogic Corporation
- Current Assignee: QuickLogic Corporation
- Current Assignee Address: CA Sunnyvale
- Main IPC: H01L23/525
- IPC: H01L23/525 ; H01L29/00 ; H01L21/44
Abstract:
Antifuses and gate arrays with antifuses are disclosed that have high thermal stability, reduced size, reduced leakage current, reduced capacitance in the unprogrammed state, improved manufacturing yield, and more controllable electrical characteristics. Some antifuses include spacers in the antifuse via. In some antifuses, the programmable material is planar, and the top or the bottom electrode is formed in the antifuse via. In some gate arrays, the antifuses are formed above the dielectric separating two levels of routing channels rather than below that dielectric.
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