- 专利标题: Ceramic circuit board with a curved lead terminal
- 专利标题(中): 陶瓷电路板
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申请号: US911713申请日: 1992-07-10
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公开(公告)号: US5328751A公开(公告)日: 1994-07-12
- 发明人: Hiroshi Komorita , Nobuyuki Mizunoya , Kazuo Matsumura , Kazuo Ikeda , Takayuki Naba , Tadashi Tanaka
- 申请人: Hiroshi Komorita , Nobuyuki Mizunoya , Kazuo Matsumura , Kazuo Ikeda , Takayuki Naba , Tadashi Tanaka
- 申请人地址: JPX Kawasaki
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JPX Kawasaki
- 优先权: JPX3-172814 19910712; JPX3-294568 19911111; JPX3-310979 19911126; JPX4-162677 19920622
- 主分类号: H01L23/498
- IPC分类号: H01L23/498 ; H05K1/02 ; H05K1/03 ; H05K3/38 ; H05K3/40 ; B32B9/00
摘要:
This invention provides a ceramic circuit board comprising: a ceramic base board; a metal circuit plate integrally bonded onto a surface of the ceramic base board; a terminal connecting port formed by bending a part of the metal circuit plate for connecting a terminal of a module, the terminal connecting port being formed so that the terminal connecting port is raised from a surface of the ceramic base board, and a curvature radius of the bent portion provided on the terminal connecting port is set to 0.2 mm or more. An empty communication hole such as groove or through hole may also be formed at a bonding surface between the metal circuit plate and the ceramic base board.
公开/授权文献
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