A flexible backplane assembly is provided wherein removable backplane modules are mounted in a platform in a manner such that the backplane modules may be removed and replaced to accommodate different types of circuit modules. Coacting guides are provided on the platform and the backplane modules to define a travel path for module insertion and removal which prevents contact with adjacent circuit and backplane modules and maneuvers around platform structural members. Connectors at the rear of each backplane module for mating withy circuit module connectors may be electrically connected to I/O boards at the front of the module to permit wiring of the backplane modules from the front of the platform.