Invention Grant
- Patent Title: Actinic radiation-reactive pressure-sensitive adhesive composition wherein adhesiveness is reduced upon irradiation
- Patent Title (中): 光化辐射反应性压敏粘合剂组合物，其中在照射时粘合性降低
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Application No.: US632190Application Date: 1990-12-21
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Publication No.: US5278199APublication Date: 1994-01-11
- Inventor: Kazuo Ohkawa , Seiichi Saito
- Applicant: Kazuo Ohkawa , Seiichi Saito
- Applicant Address: JPX Tokyo
- Assignee: Asahi Denka Kogyo K.K.
- Current Assignee: Asahi Denka Kogyo K.K.
- Current Assignee Address: JPX Tokyo
- Priority: JPX2-4936 19900112
- Main IPC: C08F2/46
- IPC: C08F2/46 ; C08F2/48 ; C08F290/00 ; C08F299/00 ; C09D5/00 ; C09J167/00 ; C09J181/02 ; C09J201/00 ; G03F7/00 ; H01L21/302 ; C09J133/06 ; C08L33/08 ; C08L33/10
Abstract:
An actinic radiation-reactive pressure-sensitive adhesive composition can be cured in air at a high speed, without irritation and bad smell, and comprises1 a pressure-sensitive adhesive organic compound, and2 an actinic radiation-curable resin comprising (1) one or more polythiol compounds and (2) one or more polyene compounds each having at least two actinic radiation-reactive carbon-to-carbon double bonds in the molecule.
Public/Granted literature
- US4807117A Interruption control apparatus Public/Granted day:1989-02-21
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