Films having a thickness of about 0.5 to about 10 mils comprising about 0.1 to about 50 weight percent of aromatic sulfone polymers and about 99.9 to about 50 percent by weight of polyamide-imides are disclosed.The films are useful in those high temperature applications which require a specimen of 10 mils or less. The alloy film can also be used in the electrical/electronic field in such applications as flexible circuit boards. The alloy film can also be die punched into high temperature spacers and washers which cannot be injection molded due to their thin cross-section.