发明授权
- 专利标题： Apparatus for treating semiconductor wafers
- 专利标题（中）： 用于处理半导体晶片的设备
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申请号： US747894申请日： 1985-06-24
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公开(公告)号： US4633893A公开(公告)日： 1987-01-06
- 发明人: Christopher F. McConnell , Alan E. Walter
- 申请人： Christopher F. McConnell , Alan E. Walter
- 申请人地址： PA Penllyn
- 专利权人： CFM Technologies Limited Partnership
- 当前专利权人： CFM Technologies Limited Partnership
- 当前专利权人地址： PA Penllyn
- 主分类号： H01L21/306
- IPC分类号： H01L21/306 ; B05B3/04 ; B05C3/109 ; B08B3/04 ; B08B7/00 ; C23C16/54 ; C30B33/00 ; H01L21/00 ; H01L21/304 ; H01L21/673 ; H01L21/677
摘要：
An improved apparatus for enclosed flow-line semiconductor wafer treatment includes a wafer-containing vessel and a mechanism for imparting plug-flow to a treatment fluid flowing into the vessel. One plug-flow imparting mechanism includes a flow-expansion input element and a fixed helical flow-diverting surface. Another mechanism incorporates a rotating flow diverting surface.
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