THE PROCESS FOR MAKING, AND THE STRUCTURE OF, AN INTERCONNECTION AND RESISTOR NETWORK UPON A SEMICONDUCTOR SURFACE. THIS NETWORK INCLUDES OHMIC CONTACTS TO THE SEMICONDUCTOR WHICH COMPRISE THE COMBINATION OF A CR-SIO CERMET MATERIAL HAVING A COPPER CONDUCTOR THEREON. THIS COMBINATION OF MATERIALS IS ALSO UTILIZED FOR INTERCONNECTIONS BETWEEN OHMIC CONTACTS. WHERE A RESISTOR IS DESIRED ALONG A INTERCONNECTION LINE, THE COPPER CONDUCTOR IS REMOVED, CAUSING THE CURRENT, WHEN AN ELECTRIC FIELD IS APPLIED, TO PASS THROUGH THE CERMET MATERIAL WHICH NOW FUNCTIONS AS A RESISTOR.