The invention relates to a sub-aperture polishing tool, comprising a support member including an attachment feature for attachment to a sub-aperture polishing machine. At an end of the support member is a polishing head comprising: a base structure attached to or integral with the support member, the base structure being arranged to provide a non-flat surface. The polishing head also comprises an outer shell, at least part of the outer surface of which defines the working surface of the polishing tool, the outer shell being affixed to the base structure so as to enclose a cavity between the outer shell and the non-flat surface. A viscoelastic material filling the cavity, located between the outer shell and the base structure.