A semiconductor package includes a buffer die, a plurality of core die blocks sequentially stacked on the buffer die, and a molding member on the buffer die and covering outer surfaces of the plurality of core die blocks. Each of the plurality of core die blocks includes a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip and a first gap filling portion, a third semiconductor chip disposed on the second semiconductor chip and a second gap filling portion, and a fourth semiconductor chip disposed on the third semiconductor chip.