Embodiments of the present disclosure provide a method for manufacturing a semiconductor package. The method includes providing a first integrated circuit (IC) die, wherein the first IC die has a first back-end-of-the-line (BEOL) structure. The method includes providing a first guard ring, wherein the first guard ring is disposed to encircle conductive features of the first BEOL. The method includes providing a second IC die, wherein the second IC die has a second BEOL structure, providing a second guard ring, wherein the second guard ring is disposed to encircle conductive features of the second BEOL. The method further includes providing an integrated BEOL structure, wherein a first side of the integrated BEOL structure is in direct contact with the first BEOL structure and the second BEOL structure.