- 专利标题: SEMICONDUCTOR DEVICES WITH AIR GATE SPACER AND AIR GATE CAP
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申请号: US18752172申请日: 2024-06-24
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公开(公告)号: US20240347625A1公开(公告)日: 2024-10-17
- 发明人: Cheng-Chi Chuang , Lin-Yu Huang , Chia-Hao Chang , Yu-Ming Lin , Ting-Ya Lo , Chi-Lin Teng , Hsin-Yen Huang , Hai-Ching Chen
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsinchu
- 分案原申请号: US16888138 2020.05.29
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L21/8234 ; H01L29/49 ; H01L29/78
摘要:
A semiconductor structure includes a substrate, a semiconductor layer, a gate stack, two first gate spacers over two opposing sidewalls of the gate stack and extending above the gate stack; a second gate spacer over a sidewall of one of the first gate spacers and having an upper portion over a lower portion; an etch stop layer adjacent to the lower portion and spaced away from the upper portion; and a seal layer over the gate stack, the two first gate spacers and the second gate spacer, resulting in a first void and a second void below the first seal layer. The first void is above the lower portion of the second gate spacer and laterally between the etch stop layer and the upper portion of the second gate spacer. The second void is above the gate stack and laterally between the two first gate spacers.
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