Invention Publication
- Patent Title: CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
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Application No.: US18609533Application Date: 2024-03-19
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Publication No.: US20240318040A1Publication Date: 2024-09-26
- Inventor: Yearin Byun , Jeongwon Lim , Boyun Kim , Sanghyun Park , Seungho Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20230039216 2023.03.24 KR 20230067730 2023.05.25
- Main IPC: C09G1/04
- IPC: C09G1/04 ; H01L21/3205 ; H01L21/321
Abstract:
Provided is a chemical mechanical polishing (CMP) slurry composition including an organic booster including an amino acid, a pH adjuster, and inorganic abrasive particles of less than 0.1 weight % with respect to a total weight of the CMP slurry composition, wherein a material constituting a remaining part of the CMP slurry composition is deionized water (DIW).
Information query
